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Conferences > ECEOC > 2012 > Tu.4.E > Tu.4.E.1

Demonstration of 12.5-Gbps Optical Interconnects Integrated with Lasers, Optical Splitters, Optical Modulators and Photodetectors on a Single Silicon Substrate

Yutaka Urino, Yoshiji Noguchi, Masataka Noguchi, Masahiko Imai, Masashi Yamagishi, Shigeru Saitou, Naoki Hirayama, Masashi Takahashi, Hiroyuki Takahashi, Emiko Saito, Makoto Okano, Takanori Shimizu, Nobuaki Hatori, Masashige Ishizaka, Tsuyoshi Yamamoto, Takeshi Baba, Takeshi Akagawa, Suguru Akiyama, Tatsuya Usuki, Daisuke Okamoto, Makoto Miura, Junichi Fujikata, Daisuke Shimura, Hideaki Okayama, Hiroki Yaegashi, Tai Tsuchizawa, Koji Yamada, Masahiko Mori, Tsuyoshi Horikawa, Takahiro Nakamura, et al.

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Abstract

Silicon optical interposers for inter-chip interconnects, integrated with an arrayed laser diode, an optical splitter, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm2 transmission density were achieved.

© 2012 Optical Society of America

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