Abstract
In this study, we measured wafer thickness using 1310nm vertical cavity surface emitting laser based swept source optical coherence tomography (OCT) and we also showed the improvement of optical axial resolution for the wafer inspection and confirmed the feasibility of swept source OCT for the industrial application.
© 2017 Optical Society of America
PDF ArticleMore Like This
Seungsu Lee, Seungsoo Hong, Jeongkyun Na, Hansol Kim, and Yoonchan Jeong
JTh2A.24 Fourier Transform Spectroscopy (FTS) 2019
Site Luo, Hao Liu, Hui Zhao, Xin An, Huikai Xie, and Li Huo
s1387 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2017
Shanshan Liang, Xinyu Li, and Jun Zhang
S4I.6 Asia Communications and Photonics Conference (ACP) 2017