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Imaging for Wafer Inspection using Vertical Cavity Surface Emitting Laser based Swept Source Optical Coherence Tomography

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Abstract

In this study, we measured wafer thickness using 1310nm vertical cavity surface emitting laser based swept source optical coherence tomography (OCT) and we also showed the improvement of optical axial resolution for the wafer inspection and confirmed the feasibility of swept source OCT for the industrial application.

© 2017 Optical Society of America

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