Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding

Arne Quellmalz; Simon Sawallich; Simon Sawallich; Maximilian Prechtl; Oliver Hartwig; Siwei Luo; Stefan Wagner; Georg S. Duesberg; Max C. Lemme; Frank Niklaus; Kristinn B. Gylfason

doi:10.1364/CLEO_SI.2021.SW3F.2

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 2021),
paper SW3F.2
•https://doi.org/10.1364/CLEO_SI.2021.SW3F.2

Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding

Arne Quellmalz, Simon Sawallich, Maximilian Prechtl, Oliver Hartwig, Siwei Luo, Stefan Wagner, Georg S. Duesberg, Max C. Lemme, Frank Niklaus, and Kristinn B. Gylfason

CLEO: Science and Innovations 2021

San Jose, California United States
9–14 May 2021
ISBN: 978-1-943580-91-0

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Photonics of Low Dimensional Materials II (SW3F)

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A. Quellmalz, S. Sawallich, M. Prechtl, O. Hartwig, S. Luo, S. Wagner, G. S. Duesberg, M. C. Lemme, F. Niklaus, and K. B. Gylfason, "Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding," in Conference on Lasers and Electro-Optics, J. Kang, S. Tomasulo, I. Ilev, D. Müller, N. Litchinitser, S. Polyakov, V. Podolskiy, J. Nunn, C. Dorrer, T. Fortier, Q. Gan, and C. Saraceno, eds., OSA Technical Digest (Optica Publishing Group, 2021), paper SW3F.2.

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Abstract

The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS₂).

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