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Conferences > CLEO_SI > 2021 > SM4I > SM4I.4

A high aspect-ratio holey metalens

Soon Wei Daniel Lim, Maryna Leonidivna Meretska, and Federico Capasso

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Abstract

We design and fabricate metalenses comprising substrateless ultra-deep via-holes in silicon with aspect ratios exceeding 30:1. Deep holes allow us to circumvent fabrication and fragility constraints which limit the aspect ratios of free-standing meta-atoms.

© 2021 The Author(s)

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