Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Laser Grooving Technology Study at Dicing Process in GaN Power Devices WLCSP

Not Accessible

Your library or personal account may give you access

Abstract

Chipping free is a dream for GaN Epi wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metallization causing higher blade loading during mechanical sawing. The critical factors (dicing blade, index speed, spindle speed, cut in depth, test pattern in the saw street, etc.) affecting cutting quality were studied and optimized. This leads to chipping penetrating under the guard ring and damaging the active area [1].

© 2021 The Author(s)

PDF Article  |   Presentation Video
More Like This
Enhanced Light Output Power by Laser Stealth Dicing in GaN-based Blue LED on Sapphire Substrate

Jianbao Zhang, Wei Zhang, Jiangnan Dai, Zhihao Wu, Yanyan Fang, and Changqing Chen
ITh2B.3 Information Optoelectronics, Nanofabrication and Testing (IONT) 2012

Laser Slicing™Process for GaN-on-GaN Technology

Vladislav Voronenkov, Natalia Bochkareva, Ruslan Gorbunov, Andrey Zubrilov, Viktor Kogotkov, Philippe Latyshev, Yuri Lelikov, Andrey Leonidov, and Yuri Shreter
cm_p_36 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2019

Advances in Ductile Mode Dicing of PPLN Devices

Lewis G. Carpenter, Samuel Berry, and Corin B. E. Gawith
NM3A.3 Nonlinear Photonics (NP) 2016

Poster Presentation

Media 1: PDF (697 KB)     

Presentation Video

Presentation video access is available to:

  1. Optica Publishing Group subscribers
  2. Technical meeting attendees
  3. Optica members who wish to use one of their free downloads. Please download the article first. After downloading, please refresh this page.

Contact your librarian or system administrator
or
Log in to access Optica Member Subscription or free downloads


More Like This
Enhanced Light Output Power by Laser Stealth Dicing in GaN-based Blue LED on Sapphire Substrate

Jianbao Zhang, Wei Zhang, Jiangnan Dai, Zhihao Wu, Yanyan Fang, and Changqing Chen
ITh2B.3 Information Optoelectronics, Nanofabrication and Testing (IONT) 2012

Laser Slicing™Process for GaN-on-GaN Technology

Vladislav Voronenkov, Natalia Bochkareva, Ruslan Gorbunov, Andrey Zubrilov, Viktor Kogotkov, Philippe Latyshev, Yuri Lelikov, Andrey Leonidov, and Yuri Shreter
cm_p_36 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2019

Advances in Ductile Mode Dicing of PPLN Devices

Lewis G. Carpenter, Samuel Berry, and Corin B. E. Gawith
NM3A.3 Nonlinear Photonics (NP) 2016

One-step waveguide endface dicing approach for Silica-on-Silicon PIC chip

Xu Liu, Zhekai Zhang, and Xiaohan Sun
JTu3A.80 Frontiers in Optics (FiO) 2018

Efficient Broadly Tunable Waveguide Lasers in Yb3+:CaF2 Produced by Deep Diamond Saw Dicing

Pavel Loiko, Ludovic Gauthier-Manuel, Gurvan Brasse, Alain Braud, Abdelmjid Benayad, and Patrice Camy
JTu3A.26 CLEO: Applications and Technology (CLEO:A&T) 2021

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved