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Conferences > CLEO_SI > 2020 > SM2O > SM2O.1

Novel Optical Fibers for Silicon Photonic Chip Packaging

Ming-Jun Li

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Abstract

We present new optical fiber designs for silicon photonic chip packing applications, including Titania-clad bend-insensitive fiber for surface coupling, D-shaped fiber for evanescent wave coupling and multicore fiber for edge coupling.

© 2020 The Author(s)

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