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Conferences > CLEO_SI > 2019 > SM1J > SM1J.7

One-chip Integrated Near-field Thermophotovoltaic Devices Using Intermediate Transparent Substrates

Takuya Inoue, Takaaki Koyama, Dongyeon Daniel Kang, Takashi Asano, and Susumu Noda

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Abstract

We develop one-chip near-field thermophotovoltaic devices, where thin-film thermal emitters (>1000K) and solar cells are integrated to the top and bottom of intermediate substrates with a sub-wavelength gap (<150nm), realizing 10-fold enhancement in the photocurrent.

© 2019 The Author(s)

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