Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding

M. Billah; M. Billah; T. Hoose; T. Hoose; T. Onanuga; N. Lindenmann; N. Lindenmann; P. Dietrich; P. Dietrich; T. Wingert; M. Goedecke; A. Hofmann; U. Troppenz; M. Moehrle; A. Sigmund; W. Freude; C. Koos; C. Koos

doi:10.1364/CLEO_SI.2015.STu2F.2

CLEO: 2015
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper STu2F.2
•https://doi.org/10.1364/CLEO_SI.2015.STu2F.2

Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding

M. Billah, T. Hoose, T. Onanuga, N. Lindenmann, P. Dietrich, T. Wingert, M. Goedecke, A. Hofmann, U. Troppenz, M. Moehrle, A. Sigmund, W. Freude, and C. Koos

CLEO: Science and Innovations 2015

San Jose, California United States
10–15 May 2015
ISBN: 978-1-55752-968-8

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Optical Interconnect on Chip (STu2F)

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M. Billah, T. Hoose, T. Onanuga, N. Lindenmann, P. Dietrich, T. Wingert, M. Goedecke, A. Hofmann, U. Troppenz, M. Moehrle, A. Sigmund, W. Freude, and C. Koos, "Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding," in CLEO: 2015, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper STu2F.2.

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Abstract

We demonstrate coupling of a horizontal-cavity surface-emitting laser (HCSEL) to a silicon photonic chip using photonic wire bonding. The technique does not require high-precision alignment of the chips. Measured coupling losses amount to approximately 4.2 dB.

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