Heterogeneous 2D and 3D Photonic Integration for Future Chip-Scale Microsystems

S. J. Ben Yoo

doi:10.1364/CLEO_SI.2015.STh3G.1

CLEO: 2015
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper STh3G.1
•https://doi.org/10.1364/CLEO_SI.2015.STh3G.1

Heterogeneous 2D and 3D Photonic Integration for Future Chip-Scale Microsystems

S. J. Ben Yoo

CLEO: Science and Innovations 2015

San Jose, California United States
10–15 May 2015
ISBN: 978-1-55752-968-8

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Fabrication Techniques I (STh3G)

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S. J. Ben Yoo, "Heterogeneous 2D and 3D Photonic Integration for Future Chip-Scale Microsystems," in CLEO: 2015, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper STh3G.1.

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Abstract

This tutorial reviews state-of-the-art heterogeneous 2D/3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems with photonic-electronic-integrated-circuits. Future prospects and challenges in computing and networking applications will also be discussed.

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