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Optical Quilt Packaging: A New Chip-to-Chip Optical Coupling and Alignment Process for Modular Sensors

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Abstract

A wide-bandwidth, highly efficient method of inter-chip waveguide coupling suitable for on-chip, mid-infrared sensing is discussed. Simulations and preliminary fabrication work on laser-to-waveguide coupling are presented, with losses predicted to be better than 6 dB.

© 2014 Optical Society of America

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