Thermal Stress in Silica Disk Resonators

Tong Chen; Hansuek Lee; Kerry J. Vahala

doi:10.1364/CLEO_AT.2013.JTu4A.47

CLEO: 2013
OSA Technical Digest (online) (Optica Publishing Group, 2013),
paper JTu4A.47
•https://doi.org/10.1364/CLEO_AT.2013.JTu4A.47

Thermal Stress in Silica Disk Resonators

Tong Chen, Hansuek Lee, and Kerry J. Vahala

CLEO: Science and Innovations 2013

San Jose, California United States
9–14 June 2013
ISBN: 978-1-55752-972-5

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POSTER SESSION I: Nanophotonics, Lightwave Communications and Biophotonics Poster Session (JTu4A)

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T. Chen, H. Lee, and K. J. Vahala, "Thermal Stress in Silica Disk Resonators," in CLEO: 2013, OSA Technical Digest (online) (Optica Publishing Group, 2013), paper JTu4A.47.

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Abstract

We investigate how thermal stress impacts silica disk resonators by comparing measurements with a finite element and an analytical model. Thicker oxide layers and proper control of undercut enable ultrahigh optical performance and mechanical stability.

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