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Multi-Layer Low-Temperature Deposited CMOS Photonics for Microelectronics Backend Integration

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Abstract

We experimentally show vertically-stacked, multi-layer, low-temperature deposited photonics for integration on processed electronics. Waveguides, microrings, and crossings are fabricated out of 400°C PECVD Si3N4, in a two layer configuration.

© 2011 Optical Society of America

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