Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Single-shot, Multiple I/O Photonic Chip to Fiber Array Packaging Using Fusion Splicing

Not Accessible

Your library or personal account may give you access

Abstract

We show a novel multiple I/O photonic packaging method for 4 fiber array using fusion splicing. We demonstrate a minimum loss of 2.5dB per facet with a variation of +/-0.1dB through a 4-fiber array.

© 2020 The Author(s)

PDF Article  |   Presentation Video
More Like This
Packaging Integrated Photonic Devices to Increase Scalability Using Laser Fusion Splicing

Juniyali Nauriyal, Meiting Song, Marissa Granados-Baez, Yi Zhang, and Jaime Cardenas
M3A.2 Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) 2022

Low loss and robust photonic packaging using fusion splicing

Juniyali Nauriyal, Meiting Song, Raymond Yu, and Jaime Cardenas
ATh3I.2 CLEO: Applications and Technology (CLEO:A&T) 2019

Fiber to Chip Fusion Splicing for Robust, Low Loss Optical Coupling

Juniyali Nauriyal, Raymond Yu, Meiting Song, and Jaime Cardenas
JW2A.72 CLEO: Applications and Technology (CLEO:A&T) 2018

Poster Presentation

Media 1: PDF (569 KB)     

Presentation Video

Presentation video access is available to:

  1. Optica Publishing Group subscribers
  2. Technical meeting attendees
  3. Optica members who wish to use one of their free downloads. Please download the article first. After downloading, please refresh this page.

Contact your librarian or system administrator
or
Log in to access Optica Member Subscription or free downloads


More Like This
Packaging Integrated Photonic Devices to Increase Scalability Using Laser Fusion Splicing

Juniyali Nauriyal, Meiting Song, Marissa Granados-Baez, Yi Zhang, and Jaime Cardenas
M3A.2 Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) 2022

Low loss and robust photonic packaging using fusion splicing

Juniyali Nauriyal, Meiting Song, Raymond Yu, and Jaime Cardenas
ATh3I.2 CLEO: Applications and Technology (CLEO:A&T) 2019

Fiber to Chip Fusion Splicing for Robust, Low Loss Optical Coupling

Juniyali Nauriyal, Raymond Yu, Meiting Song, and Jaime Cardenas
JW2A.72 CLEO: Applications and Technology (CLEO:A&T) 2018

Low-Loss, High Extinction Ratio Fiber to Chip Connection via Laser Fusion for Polarization Maintaining Fibers

Sushant Kumar, Juniyali Nauriyal, and Jaime Cardenas
M3C.1 Optical Fiber Communication Conference (OFC) 2023

Novel Optical Fibers for Silicon Photonic Chip Packaging

Ming-Jun Li
SM2O.1 CLEO: Science and Innovations (CLEO:S&I) 2020

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved