Abstract

The use of ultrafast laser pulses for surface processing has gained interest due to the possibility to obtain micro and submicrometric structuring on various substrates with the flexibility of the laser irradiation tool accompanied with the progress of the commercially ultrafast laser sources in terms of robustness. Many application fields are impacted, moslty related to adding functions to surfaces like wettability, optical properties and cellular differentiation [1-3]. When using ultrafast laser pulses for surface structuring, the low onset of thermal effects permits to achieve high quality surface ablation especially in optimal fluence and repetition regimes where the ablation depth can be controlled with a sub-micrometric precision.

© 2019 IEEE