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  • 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference
  • OSA Technical Digest (Optica Publishing Group, 2019),
  • paper cm_2_1

Internal structuring of silicon by ultrafast laser irradiation

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Abstract

An important challenge in the field of three-dimensional (3D) ultrafast laser processing is to achieve permanent modifications in the bulk of silicon (Si) and narrow-gap materials. Attempts by increasing the energy of infrared femtosecond pulses with conventional laser machining configurations have failed [1]–[3].

© 2019 IEEE

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