Abstract

Integrated Microwave Photonics (IMWP), the manipulation of radio-frequency (RF) signals using photonic integrated circuits (PICs), has recently attracted significant attention. IMWP enables RF signal processing with a high-degree of reconfigurability and ultra-wide bandwidth that will transform applications such as wireless communication and radar. But unlike electronic integrated circuits which are mostly fabricated in silicon, the material platform for IMWP is not well-consolidated. Most functionalities have been demonstrated in silicon-on-insulator (SOI) nanowires with a standard geometry (450nm × 220nm) due to their wide availability.

© 2015 IEEE