Abstract
High throughput ultrafast laser processing of bulk fused silica photomask substrate for producing DUV radiation (193 and 248 nm) attenuating 3D structures is of great importance for photomask repair and modification [1, 2], In this paper we present the method for high-speed 3D structures patterning inside the volume of photomask substrate without affecting front mask surface and absorber layer using ultrafast laser and the results of investigation of DUV radiation attenuation by created structures.
© 2007 IEEE
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