Internal Structuring of Silicon using THz-Repetition-Rate Trains of Ultrashort Pulses

A. Wang; A. Das; D. Grojo

doi:10.1364/CLEO_AT.2020.ATu3K.4

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 2020),
paper ATu3K.4
•https://doi.org/10.1364/CLEO_AT.2020.ATu3K.4

Internal Structuring of Silicon using THz-Repetition-Rate Trains of Ultrashort Pulses

A. Wang, A. Das, and D. Grojo

CLEO: Applications and Technology 2020

Washington, DC United States
10–15 May 2020
ISBN: 978-1-943580-76-7

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Laser-Based Photonic Fabrication and Integration (ATu3K)

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A. Wang, A. Das, and D. Grojo, "Internal Structuring of Silicon using THz-Repetition-Rate Trains of Ultrashort Pulses," in Conference on Lasers and Electro-Optics, OSA Technical Digest (Optica Publishing Group, 2020), paper ATu3K.4.

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Abstract

We generate and apply trains of infrared femtosecond pulses at the highest achievable repetition-rates. This gives unique multi-timescale control parameters used for improved energy deposition and reliable 3D laser writing deep inside silicon.

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