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Measuring the wafer thickness and refractive index by spectral interferometry of optical frequency comb

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Abstract

We present a spectral interferometry method of optical frequency comb for measuring the thickness and refractive index distribution of silicon wafer. The repeatability of thickness measurement is 50 nm, and the stability of refractive index is 5×10-4. © 2020 The Author(s)

© 2020 The Author(s)

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