Abstract

In this paper, the study on polishing characteristics of sapphire using a short pulse (25ps) ultraviolet laser (355nm) was conducted. The polished surfaces were observed and their surface roughness Ra was measured to analyze the correlations of surface roughness with pulse conditions, such as the influences of laser fluence, incidence angle, scanning speed and scanning manner. The research results show that the surface roughness Ra of polished sapphire wafer was improved obviously as the fluence increases, with the increase of laser incidence angle or scanning times, the surface roughness of sapphire decreases. And the surface roughness increases with the increase of laser scanning speed.

© 2009 IEEE

PDF Article

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription