A new laser crack-free cutting technique for dense ceramics with thickness of ≥ 10 mm based on beam continuous piercing full through the workpieces is presented. The techology can be concluded as a feasible tool for cutting of thick and dense ceramics in complex path, even for 3D cutting.

© 2009 IEEE

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription