Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • Conference on Lasers and Electro-Optics/International Quantum Electronics Conference
  • OSA Technical Digest (CD) (Optica Publishing Group, 2009),
  • paper CTuAA6
  • https://doi.org/10.1364/CLEO.2009.CTuAA6

Nanometer Metrology Using Ultrafast Optoacoustics

Not Accessible

Your library or personal account may give you access

Abstract

We present a method for accessing nanoscale dimensions in semiconductor wafer metrology, using ultrafast optoacoustic ranging. One illustrative example is the measurement of dimensions and profile of nanometer scale deep trenches in silicon-wafer based structures.

© 2009 Optical Society of America

PDF Article
More Like This
Deflectometry Challenges Interferometry: 3D-Metrology from Nanometer to Meter

G. Häusler, M. C. Knauer, C. Faber, C. Richter, S. Peterhänsel, C. Kranitzky, and K. Veit
DMC4 Digital Holography and Three-Dimensional Imaging (DH) 2009

Ultrafast Optical Measurements of Coherent Acoustic Phonon Attenuation in Silicon

B.C. Daly, K. Kang, and D.G. Cahill
IWD1 International Quantum Electronics Conference (IQEC) 2009

Deflectometry Challenges Interferometry: 3-D-Metrology from Nanometer to Meter

Gerd Häusler, M. C. Knauer, C. Faber, C. Richter, S. Peterhänsel, C. Kranitzky, and K. Veit
FWV1 Frontiers in Optics (FiO) 2009

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved