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  • Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies
  • OSA Technical Digest (CD) (Optica Publishing Group, 2008),
  • paper CThKK5

Localized Substrate Removal Technique Enabling Strong Confinement Microphotonics in Bulk Si CMOS Processes

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Abstract

A novel post processing fabrication technique, based on XeF2 etching, has been developed to locally remove the silicon substrate beneath polysilicon waveguides, enabling integration of low loss strong confinement microphotonics into standard bulk silicon CMOS process flows.

© 2008 Optical Society of America

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