Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science and Photonic Applications Systems Technologies
  • Technical Digest (CD) (Optica Publishing Group, 2005),
  • paper JThE1

Experimental Study for Low Resistance Interline Connections Using Pulsed Laser Techniques

Not Accessible

Your library or personal account may give you access

Abstract

Applications of laser repair for integrated circuits (IC) chips, which exhibit large-scale redundancy in their designs, have been improved for yield enhancement [1]. A short pulse laser is employed to remove defective elements and replace them with redundant ones. In present semiconductor manufacturing, the laser is general used to cut metal lines, but it has become increasingly difficult with the development of multilevel metallization processes. The lower corner cracks of the metal lines were demonstrated to be unfavorable for the electrical disconnection of the fuse, because it leads to the low yields and eventually becomes the limit for the laser energy process window [2].

© 2005 Optical Society of America

PDF Article
More Like This
Connecting conductors on semiconductor devices by lasers

Mikio Hongo, Tateoki Miyauchi, Hiroshi Yamaguchi, Toshiaki Masuhara, and Osamu Minato
THD2 Conference on Lasers and Electro-Optics (CLEO:S&I) 1982

Development of a pulsed quantum cascade laser based CO sensor using advanced signal processing techniques

S. G. So, G. Wysocki, D. Weidmann, and F. K. Tittel
JTuC50 Conference on Lasers and Electro-Optics (CLEO:S&I) 2005

Laser Fuse Processing for Advanced Memory Designs

Joohan Lee and James Cordingley
STuA2 Frontiers in Optics (FiO) 2010

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved