High Precision Laser Micromachining Depths by Pulsed Near Ultraviolet and Mid-UV Nd:YAG Laser of Sapphire and Silicon for Microfluidic Applications

Tai-Chang Chen; R. Bruce Darling

Conference on Lasers and Electro-Optics/International Quantum Electronics Conference and Photonic Applications Systems Technologies
Technical Digest (CD) (Optica Publishing Group, 2004),
paper CFK5

High Precision Laser Micromachining Depths by Pulsed Near Ultraviolet and Mid-UV Nd:YAG Laser of Sapphire and Silicon for Microfluidic Applications

Tai-Chang Chen and R. Bruce Darling

Conference on Lasers and Electro-Optics 2004

San Francisco, California United States
16–21 May 2004
ISBN: 1-55752-770-9

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Laser Nanoprocessing (CFK)

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T. Chen and R. B. Darling, "High Precision Laser Micromachining Depths by Pulsed Near Ultraviolet and Mid-UV Nd:YAG Laser of Sapphire and Silicon for Microfluidic Applications," in Conference on Lasers and Electro-Optics/International Quantum Electronics Conference and Photonic Applications Systems Technologies, Technical Digest (CD) (Optica Publishing Group, 2004), paper CFK5.

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Abstract

We explore the use of near-UV and mid-UV Nd: YAG laser for rapid micromachining for microfluidic applications. The laser ablation depths and precision on sapphire and silicon have been discussed.

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