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  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 2002),
  • paper CTuF6

Demonstration of a Wavelength Division Multiplexed Chip-to-Chlp Optical Interconnect

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Abstract

Wavelength division multiplexing simplifies optical interconnect packaging in that many channels can be combined and transported over a single fiber. The use of a single broadband optical source potentially decreases cost in a short-distance interconnect, while the use of femtosecond pulses provides additional advantages, including the removal of interconnect skew and jitter.1 We combine these advantages by using a mode- locked Ti:Sapphire laser as the optical source in a proof-of-concept chip-to-chip optical interconnect. The 150-fs pulses from the laser have a spectral bandwidth of approximately 5 nm, at a center wavelength of 860 nm. While previous work2 has demonstrated the principle of using short pulses for wavelength division multiplexing, we demonstrate operation of a full system including GaAs devices hybridly integrated to functional silicon logic.

© 2002 Optical Society of America

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