Abstract
Defection of material contaminates and material defects on microelectronic-grade silicon wafers is necessary to ensure high-quality material before beginning the value-added processing.1 Structural properties of thin films and subsurface layers are important for material characterization and phase identification.2 We report on our recent results on applying different optical techniques for microscopic imaging of semiconductor and ceramic layers.
© 2001 Optical Society of America
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