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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 2000),
  • paper CFK4

Dynamics of material removal in ultrashort laser ablation of dielectrics

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Abstract

Non thermal and thermal processes are evidenced in near infrared, ultrashort (sub-ps and ps) pulse laser ablation of wide band-gap dielectrics with accent on the etch phases in case of laser irradiated sapphire (c-Al2O3) depending on the laser parameters controlling the ablation process: number of pulses, laser fluence and pulse duration.

© 2000 Optical Society of America

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