Femtosecond Interferometry for analysis of internal bond interface delamination in semiconductor devices

A. N. Cartwright, Nathan A. Merkel, and Matthew D. Blasczak

Conference on Lasers and Electro-Optics 1998

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Abstract

In this work, we developed an ultrafast Twyman-Green interferometer (Fig. 1) to monitor deformations in the bonding layer between two materials.

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