Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > CLEO > 1996 > CWE > CWE2
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1996),
  • paper CWE2

Direct-write gold and silicon ablation on a 100-nm scale

Igor I. Smolyaninov, David L. Mazzoni, and Christopher C. Davis

Not Accessible

Your library or personal account may give you access

Abstract

The current trend in microelectronics fabrication is to reduce the number of processing steps. Laser-assisted etching and laser ablation are attractive because they do not require complicated lithographic surface preparation. However, the resolution of these laser-based techniques is limited by diffraction and, in fact, is never below the micrometer range.

© 1996 Optical Society of America

PDF Article
More Like This
Fabrication of Submicron Feature Diffractive Elements using Near-Field Direct-Write Ultra-Violet Lithography

Igor I. Smolyaninov, Joseph N. Mait, David L. Mazzoni, and Christopher C. Davis
DWD.3 Diffractive Optics and Micro-Optics (DOMO) 1996

Fabrication of silicon 3D photonic crystal structures in 100nm scale using double directional etchings method

Daihei Hippo, Yoshiyuki Kawata, Yoshishige Tsuchiya, Hiroshi Mizuta, Shunri Oda, Kei Urakawa, and Nobuyoshi Koshida
JTuD47 Conference on Lasers and Electro-Optics (CLEO:S&I) 2006

100 nm-Level Air Holes Machined with Laser Direct Writing Method

Ming Li, Kiyotaka Mori, Christian Greig, Xinbing Liu, Yoshimasa Sugimoto, Naoki Ikeda, and Kiyoshi Asakawa
CMV2 Conference on Lasers and Electro-Optics (CLEO:S&I) 2003

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use