Abstract

Recently, fluidic self-assembly (FSA) has been demonstrated for optoelectronic integration. [1,2] In this process, semiconductor devices are fabricated into trapezoidal blocks which are then suspended in a carrier liquid. The liquid is dispensed over a substrate in which correspondingly-shaped receptor holes have been etched. Under the resulting fluid transport, blocks rapidly self-assemble into the holes. This technique is more powerful than other integration techniques such as epitaxial liftoff (ELO). FSA is a parallel process, and has the capability for integrating thousands of devices on a single wafer with no alignment.

© 1995 Optical Society of America