Abstract
Removal of the plastic insulation from electrically conducting wires, often called wire stripping, has been performed by a variety of mechanical and electrical methods to allow contact with other wires or electrical devices. With the growth in microelectronics, industry has sought new methods that will provide highly precise clean removal of submillimeter lengths of insulation. The work addressed here on excimer laser wire stripping clearly demonstrates the potential of this method.
© 1990 Optical Society of America
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