Abstract
In the fabrication of multilayered packages, electrical vias or feedthroughs are required to electrically interconnect the various layers of the package. Traditionally, these vias have been generated in the sheet by mechanical methods which have limitations. Lasers are being evaluated as a possible alternative method of generating via holes. The main concern in laser drilling is via quality, consistency, and throughput.
© 1986 Optical Society of America
PDF ArticleMore Like This
H. L. Tan, E. Viscito, J. P. Allebach, and E. J. Delp
ThA2 Optical Fabrication and Testing (OF&T) 1986
E. G. Yousif and A. H. M. Al-Janabi
TUK53 Conference on Lasers and Electro-Optics (CLEO:S&I) 1986
D. Antonov, E. Weynant, G. Petite, and S. Guizard
CM_7 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2007