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TEA copper vapor laser

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Abstract

Recently we reported on development of a novel transverse-discharge copper vapor laser (TD-CVL) pumped by a fast current pulse generated by a flat-plate double Blumlein pulse-forming circuit.1,2 We carried out detailed measurements of some performance parameters of the TD-CVL in various operating conditions.3 The results indicate that the TD-CVL promises to become the next generation of the CVL in many respects, in particular, the capability of high E/(Nn)1/2 operations under high-buffer gas pressure provides a number of advantages over the conventional longitudinal-discharge CVL. Here E is the electric field, W is the buffer gas number density, and n is the copper vapor density.

© 1986 Optical Society of America

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