Abstract

The laser-directed discretionary deposition of metal films broadens the scope of electronics fabrication on the integrated circuit level as well as in hybrid packaging, microwave circuit tuning, and wafer-scale systems. The use of laser beams to write and remove directly metals and insulators has been developed and refined to the point where applications to real integrated circuits are possible. This mode of processing allows the modification of individual circuits on a micrometer scale as well as permitting the interconnection of larger circuits composed of several devices, both on a single substrate (wafer scale integration) and in multichip hybrid configurations. It has been shown previously that by this technology one can customize commercial CMOS gate array parts in several minutes without masked photolithography.¹

© 1986 Optical Society of America