Abstract
The phased-array laser is the most promising candidate to give high output power over 100 mW. At high-power cw operation, the output power-current characteristics tend to saturate because the Junction temperature rises due to the high current. Hence the junction-down (J-down) mounting is important in achieving high-power cw operation. Generally, soft solders such as In alloys have been employed for the J-down assembly to avoid the mechanical stress between laser chip and heat sink. These solders, however, have many disadvantageous effects on reliability, such as solder migration into the laser crystal or formation of whisker.1,2
© 1986 Optical Society of America
PDF ArticleMore Like This
Takayoshi Mamine, T. Okada, K. Kaise, and O. Yoneyama
TUQ3 Conference on Lasers and Electro-Optics (CLEO:S&I) 1986
K. ISSHIKI, N. KANENO, J. OHSAWA, H. KUMABE, H. NAMIZAKI, K. IKEDA, and W. SUSAKI
TuJ2 Optical Fiber Communication Conference (OFC) 1986
S. C. Wang and L Z. Gacusan
WR5 OSA Annual Meeting (FIO) 1986