Abstract

On printed circuits of high density for computer applications, conductor lines in x and y directions are often segregated into two different planes. The interconnection of line segments is done with plated-through holes, called vias. A typical multilayer printed circuit board may have several such signal cores, laminated to other conductor planes which carry power and ground connections. A high packing density is achieved by minimizing the spacing and dimensions of circuit lines.

© 1981 Optical Society of America