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  • Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC)
  • OSA Technical Digest (Optica Publishing Group, 2020),
  • paper M4A.354
  • https://doi.org/10.1364/ACPC.2020.M4A.354

A Bonding Structure with Low Return Loss and High Transmission Bandwidth for Microwave Circuit

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Abstract

In this paper, we present a bonding interconnect structure based on multi-stub impedance matching. The proposed structure has excellent high-frequency performance with 3dB bandwidth of 65.9 GHz and return loss of -15.533dB at 40 GHz.

© 2020 The Author(s)

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