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Conferences > ACPC > 2019 > M4A > M4A.245
  • Asia Communications and Photonics Conference (ACPC) 2019
  • OSA Technical Digest (Optica Publishing Group, 2019),
  • paper M4A.245

A study of overflowed epoxy resin in a butt-coupling with FAB and EML mounted on PCB for a compact optic design of Ethernet 100G/400G CWDM4 data center application

Jyung Chan Lee, Joon Ki Lee, Eun-Gu Lee, Kyeongwan Jeon, Sang Wan Park, Changhyun Kang, and Jong Ha Moon

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Abstract

We investigated results of overflowed epoxy resin in a butt-coupling. We could obtain the higher coupling efficiency due to the narrower beam divergence and explain the better heat transfer utilizing conduction and convection mechanism.

© 2019 The Author(s)

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