Inverse-Design-based Light Via for Multi-Layer Photonic Integration Circuit

Zexin Yu; Jifang Qiu; Zhenli Dong; Li Zheng; Hongxiang Guo; Jian Wu

Asia Communications and Photonics Conference (ACP) 2018
OSA Technical Digest (Optica Publishing Group, 2018),
paper Su2A.130

Inverse-Design-based Light Via for Multi-Layer Photonic Integration Circuit

Zexin Yu, Jifang Qiu, Zhenli Dong, Li Zheng, Hongxiang Guo, and Jian Wu

Asia Communications and Photonics Conference 2018

Hangzhou China
26–29 October 2018
ISBN: 978-1-5386-6158-1

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Z. Yu, J. Qiu, Z. Dong, L. Zheng, H. Guo, and J. Wu, "Inverse-Design-based Light Via for Multi-Layer Photonic Integration Circuit," in Asia Communications and Photonics Conference (ACP) 2018, OSA Technical Digest (Optica Publishing Group, 2018), paper Su2A.130.

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Abstract

A multi-layer light via for TE-polarized light is proposed based on inverse design. Simulation results show that the insertion loss is 0.55dB at 1550nm, and the device has an ultra-wide 1dB bandwidth of 1451-1712nm.

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