Surface structure modification is an effective way to enhance light extraction of LED. In this study, light extraction microstructure (LEM) at the chip surface manufactured by micro cutting was proposed. Micro cutting experimental system was built, the material deformation during cutting, influence of cutting depth and distance, phenomenon happened with two direction cross cutting were studied. With micro cutting, the plastic cutting of GaN materials can be realized. The cutting force increase linearly while the cutting depth increase. The cutting distance ahould 1.5 times larger than the groove depth. Same depth on two cutting direction should be used.
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