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Conferences > ACPC > 2016 > AF4F > AF4F.4

Ultra-dense Silicon Photonics Coupling Solution for Optical Chip Scale Package Transceiver

Qing Zhao, Xiaolu Song, Zhen Dong, Lei Gao, Ruiqiang Ji, Yanbo Li, Ling Hao, Shengmeng Fu, and Li Zeng

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Abstract

We propose a high-density, low-power optical chip scale package transceiver scheme facing future high capacity network. With novel ultra-dense SiPh coupling solution, OCSP with 336 channels is achievable in scenarios of edge and surface coupling.

© 2016 Optical Society of America

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