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Conferences > ACPC > 2012 > ATh3B > ATh3B.1

Coupling and packaging issues of silicon based photonic integrated circuits

Christophe Kopp, Stephane Bernabe, Daivid Fowler, Philippe Grosse, Jean-Marc Fedeli, and Sylvie Menezo

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Abstract

We review the two opposing challenges that fiber coupling of silicon photonic circuits has to deal with. The first being high performance with different requirements for emitters and receivers. The second being that of packaging assembly tolerances.

© 2012 Optical Society of America

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